DocumentCode :
1733612
Title :
Compact 3D integrable SU8 embedded microwave bandpass filters using complementary split ring resonator loaded half mode substrate integrated waveguide
Author :
Senior, David E. ; Cheng, X. ; Jao, P. ; Kim, C. ; Yoon, Y.K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Florida, Gainesville, FL, USA
fYear :
2011
Firstpage :
1963
Lastpage :
1969
Abstract :
A 3D integrable, compact SU8 epoxy embedded evanescent wave half mode substrate integrated waveguide (HMSIW) microwave resonator and a bandpass filter at 12GHz (Ku band) have been designed and fabricated by using a multilayer surface micromachining fabrication process. Evanescent wave amplification with forward transmission below the characteristic waveguide cutoff frequency is achieved with the use of complementary split ring resonators (CSRR) loaded on the top surface of a half mode substrate integrated waveguide, resulting in compact resonators with controllable Q factor and dual band operation capability. The use of the photopatternable SU8 epoxy as the dielectric for implementing the embedded RF passive devices enables tall vertical interconnects and multilayer 3D passives with high-Q factors, the integration of MEMS devices on CMOS circuits with its low temperature capability, and batch fabrication of multiple devices. Full wave electromagnetic simulations shows promising results at 12 GHz, with a Q factor of 12 to 19 and a great size reduction of more than 50% when compared with conventional PCB implementations.
Keywords :
Q-factor; band-pass filters; micromachining; micromechanical resonators; microwave filters; microwave resonators; resonator filters; substrate integrated waveguides; CMOS circuits; CSRR; HMSIW microwave resonator; MEMS devices; PCB implementations; batch fabrication; characteristic waveguide cutoff frequency; compact 3D integrable SU8 embedded microwave bandpass filters; compact SU8 epoxy embedded evanescent wave; compact resonators; complementary split ring resonators; controllable Q factor; dual band operation capability; embedded RF passive devices; evanescent wave amplification; forward transmission; full wave electromagnetic simulations; half mode substrate integrated waveguide microwave resonator; high-Q factors; low temperature capability; multilayer 3D passives; multilayer surface micromachining fabrication process; multiple devices; photopatternable SU8 epoxy; size reduction; tall vertical interconnects; top surface; Band pass filters; Cutoff frequency; Electromagnetic waveguides; Microwave filters; Q factor; Resonator filters; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2011.5898785
Filename :
5898785
Link To Document :
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