Compact electromagnetic-bandgap structures for embedding into Si and glass interposers

Miniaturized electromagnetic bandgap (EBG) structures with a stopband that covers the 2.4 GHz band have been developed, and their integration to Si and glass interposers has also been studied. The unit cell size can be reduced down to 0.7 mm × 0.7 mm by combining thin film dielectrics with inductance-enhanced EBG structures. The appearance of the bandgaps can be controlled by the dielectric layer thickness and the inductor in unit cells. Simple 3D planar electromagnetic (EM) analysis is useful for prediction of the stopband for the EBG structures embedded in the interposers. The developed EBG structures can be integrated into glass interposers, and the EBG-structure-embedded interposers are expected to suppress power plane noise propagating outward from packages.