DocumentCode
1733700
Title
Failing Frequency Signature Analysis
Author
Lee, Jaekwang ; McCluskey, Edward J.
Author_Institution
Center for Reliable Comput., Stanford Univ., Stanford, CA
fYear
2008
Firstpage
1
Lastpage
8
Abstract
A failing frequency signature is a collection of the maximum operating frequencies of each pattern in a pattern set. Analyzing the failing frequency signature can successfully detect small-delay defects, because even a small-delay defect can cause an outlier to appear in a failing frequency signature. Moreover, the failing frequency signature will be consistent even in the presence of process variations. Failing frequency signature analysis can effectively detect very hard-to-find defects that occur in No-Trouble-Found (NTF) devices, without the necessity of thorough test patterns. The analysis can also be used for characterization tests. In this paper, experimental results using the failing frequency signature to detect small-delay defects are presented using test chips fabricated in a 0.18 mum technology.
Keywords
signal processing; failing frequency signature analysis; no-trouble-found devices; small-delay defects; Circuit testing; Debugging; Delay; Failure analysis; Frequency; Integrated circuit testing; Manufacturing; Pattern analysis; Production; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2008. ITC 2008. IEEE International
Conference_Location
Santa Clara, CA
ISSN
1089-3539
Print_ISBN
978-1-4244-2402-3
Electronic_ISBN
1089-3539
Type
conf
DOI
10.1109/TEST.2008.4700561
Filename
4700561
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