• DocumentCode
    1733700
  • Title

    Failing Frequency Signature Analysis

  • Author

    Lee, Jaekwang ; McCluskey, Edward J.

  • Author_Institution
    Center for Reliable Comput., Stanford Univ., Stanford, CA
  • fYear
    2008
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    A failing frequency signature is a collection of the maximum operating frequencies of each pattern in a pattern set. Analyzing the failing frequency signature can successfully detect small-delay defects, because even a small-delay defect can cause an outlier to appear in a failing frequency signature. Moreover, the failing frequency signature will be consistent even in the presence of process variations. Failing frequency signature analysis can effectively detect very hard-to-find defects that occur in No-Trouble-Found (NTF) devices, without the necessity of thorough test patterns. The analysis can also be used for characterization tests. In this paper, experimental results using the failing frequency signature to detect small-delay defects are presented using test chips fabricated in a 0.18 mum technology.
  • Keywords
    signal processing; failing frequency signature analysis; no-trouble-found devices; small-delay defects; Circuit testing; Debugging; Delay; Failure analysis; Frequency; Integrated circuit testing; Manufacturing; Pattern analysis; Production; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2008. ITC 2008. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-2402-3
  • Electronic_ISBN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2008.4700561
  • Filename
    4700561