A MEMS socket system for high density SoC interconnection

The design of a microelectromechanical systems (MEMS) socket system to enable the temporary high density interconnection of a CMOS die to a System-on-Chip (SoC) implementation of a tester is described. Connectivity is achieved with a fixed MEMS socket that is thermosonically bonded to a CMOS tester die and a carrier MEMS socket that acts as a custom die-specific removable insert for the fixed socket to easily interface the die being tested to the SoC based tester. A new cantilevered bridge-type microspring contact provides direct connectivity to the I/O pads of the die under test. The bridge-type contact spring geometry has excellent elastic properties and features a contact resistance of 19.3 mΩ at a contact force of 1.35 mN. The MEMS socket system was designed and simulated using IntelliSuite CAD tools and fabrication arrangements are being pursued.