DocumentCode
1734302
Title
Metamaterial-inspired absorbers for Terahertz packaging applications
Author
Park, Kyoung Youl ; Hejase, Jose A. ; Meierbachtol, Collin S. ; Wiwatcharagoses, Nophadon ; Chahal, Prem
Author_Institution
Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
fYear
2011
Firstpage
2107
Lastpage
2113
Abstract
In this paper, thin metamaterial-inspired structures are investigated for wide-band absorption of stray signals for THz packages. The absorber itself consists of a low-index, low-loss dielectric sandwiched between a patterned, two-dimensionally periodic, thin metallic layer, and a metal backing. Numerical simulations were performed using both the finite element (FEM) and finite-difference time domain (FDTD) numerical methods. Design, fabrication and tests were carried out for absorbers having center frequencies of 0.2 THz and 0.4 THz. Ultra-wide bandwidth and strong absorption were obtained by taking advantage of skin-effect losses in metamaterial structures, and through multi-stacking of these structures. Absorbers having high absorption coefficients and bandwidth (>; 1THz) can easily be fabricated using the approach demonstrated in this paper. Two measurement approaches are applied to characterize these structures, details of which are presented in this paper.
Keywords
electronics packaging; metamaterials; terahertz wave devices; THz packages; finite element method; finite-difference time domain method; metal backing; metamaterial structures; metamaterial-inspired absorbers; skin-effect losses; stray signals; terahertz packaging applications; thin metallic layer; thin metamaterial-inspired structures; wide-band absorption; Absorption; Dielectrics; Electromagnetic waveguides; Metals; Metamaterials; Reflection; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-61284-497-8
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2011.5898809
Filename
5898809
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