• DocumentCode
    1734302
  • Title

    Metamaterial-inspired absorbers for Terahertz packaging applications

  • Author

    Park, Kyoung Youl ; Hejase, Jose A. ; Meierbachtol, Collin S. ; Wiwatcharagoses, Nophadon ; Chahal, Prem

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
  • fYear
    2011
  • Firstpage
    2107
  • Lastpage
    2113
  • Abstract
    In this paper, thin metamaterial-inspired structures are investigated for wide-band absorption of stray signals for THz packages. The absorber itself consists of a low-index, low-loss dielectric sandwiched between a patterned, two-dimensionally periodic, thin metallic layer, and a metal backing. Numerical simulations were performed using both the finite element (FEM) and finite-difference time domain (FDTD) numerical methods. Design, fabrication and tests were carried out for absorbers having center frequencies of 0.2 THz and 0.4 THz. Ultra-wide bandwidth and strong absorption were obtained by taking advantage of skin-effect losses in metamaterial structures, and through multi-stacking of these structures. Absorbers having high absorption coefficients and bandwidth (>; 1THz) can easily be fabricated using the approach demonstrated in this paper. Two measurement approaches are applied to characterize these structures, details of which are presented in this paper.
  • Keywords
    electronics packaging; metamaterials; terahertz wave devices; THz packages; finite element method; finite-difference time domain method; metal backing; metamaterial structures; metamaterial-inspired absorbers; skin-effect losses; stray signals; terahertz packaging applications; thin metallic layer; thin metamaterial-inspired structures; wide-band absorption; Absorption; Dielectrics; Electromagnetic waveguides; Metals; Metamaterials; Reflection; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-61284-497-8
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2011.5898809
  • Filename
    5898809