DocumentCode
1734434
Title
Damage prediction in graphene thermoplastics for potential electronic packaging applications
Author
Oterkus, Erkan ; Madenci, Erdogan
Author_Institution
Nat. Inst. of Aerosp., Hampton, VA, USA
fYear
2011
Firstpage
2134
Lastpage
2140
Abstract
Graphene is a promising material for electronics industry due to its unique mechanical and electronic properties. In this study, the failure analysis of the graphene sheets is performed by using Peridynamic theory due to its unique capability in failure prediction at the continuum level and the similarity of its mathematical structure to the molecular dynamic simulations (MDS). The current approach is validated against MDS predictions by considering zig-zag and armchair type single layer graphene sheets with an initial edge notch subjected to tension loading. Finally, a similar analysis is performed for multi-layered graphene layers which are either commensurate or incommensurate to investigate the effect of number of zigzag and armchair type graphene sheets and their stacking sequence on failure modes.
Keywords
electronics packaging; failure analysis; graphene; molecular dynamics method; damage prediction; electronic packaging; electronic properties; electronics industry; failure analysis; failure prediction; graphene sheets; graphene thermoplastics; mathematical structure; mechanical properties; molecular dynamic simulations; peridynamic theory; Atomic layer deposition; Carbon; Equations; Force; Loading; Materials; Stacking;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-61284-497-8
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2011.5898814
Filename
5898814
Link To Document