DocumentCode :
1734434
Title :
Damage prediction in graphene thermoplastics for potential electronic packaging applications
Author :
Oterkus, Erkan ; Madenci, Erdogan
Author_Institution :
Nat. Inst. of Aerosp., Hampton, VA, USA
fYear :
2011
Firstpage :
2134
Lastpage :
2140
Abstract :
Graphene is a promising material for electronics industry due to its unique mechanical and electronic properties. In this study, the failure analysis of the graphene sheets is performed by using Peridynamic theory due to its unique capability in failure prediction at the continuum level and the similarity of its mathematical structure to the molecular dynamic simulations (MDS). The current approach is validated against MDS predictions by considering zig-zag and armchair type single layer graphene sheets with an initial edge notch subjected to tension loading. Finally, a similar analysis is performed for multi-layered graphene layers which are either commensurate or incommensurate to investigate the effect of number of zigzag and armchair type graphene sheets and their stacking sequence on failure modes.
Keywords :
electronics packaging; failure analysis; graphene; molecular dynamics method; damage prediction; electronic packaging; electronic properties; electronics industry; failure analysis; failure prediction; graphene sheets; graphene thermoplastics; mathematical structure; mechanical properties; molecular dynamic simulations; peridynamic theory; Atomic layer deposition; Carbon; Equations; Force; Loading; Materials; Stacking;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2011.5898814
Filename :
5898814
Link To Document :
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