• DocumentCode
    1734434
  • Title

    Damage prediction in graphene thermoplastics for potential electronic packaging applications

  • Author

    Oterkus, Erkan ; Madenci, Erdogan

  • Author_Institution
    Nat. Inst. of Aerosp., Hampton, VA, USA
  • fYear
    2011
  • Firstpage
    2134
  • Lastpage
    2140
  • Abstract
    Graphene is a promising material for electronics industry due to its unique mechanical and electronic properties. In this study, the failure analysis of the graphene sheets is performed by using Peridynamic theory due to its unique capability in failure prediction at the continuum level and the similarity of its mathematical structure to the molecular dynamic simulations (MDS). The current approach is validated against MDS predictions by considering zig-zag and armchair type single layer graphene sheets with an initial edge notch subjected to tension loading. Finally, a similar analysis is performed for multi-layered graphene layers which are either commensurate or incommensurate to investigate the effect of number of zigzag and armchair type graphene sheets and their stacking sequence on failure modes.
  • Keywords
    electronics packaging; failure analysis; graphene; molecular dynamics method; damage prediction; electronic packaging; electronic properties; electronics industry; failure analysis; failure prediction; graphene sheets; graphene thermoplastics; mathematical structure; mechanical properties; molecular dynamic simulations; peridynamic theory; Atomic layer deposition; Carbon; Equations; Force; Loading; Materials; Stacking;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-61284-497-8
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2011.5898814
  • Filename
    5898814