Title :
Solder Bead on High Density Interconnect Printed Circuit Board
Author_Institution :
Intel Corp., Hillsboro, OR
Abstract :
Solder bead probing is a test technology primarily targeting high-speed/high-density printed circuit boards (PCBs). High Density Interconnect (HDI) PCBs are gaining in popularity to support high speed and smaller form factor requirements. This paper summarizes the requirements for placing solder beads on HDI PCBs.
Keywords :
printed circuits; solders; HDI PCB; Solder bead probing; high density interconnect printed circuit board; Apertures; Circuit testing; Electronics packaging; Graphics; Integrated circuit interconnections; Printed circuits; Routing; Signal resolution; US Department of Energy; Vehicles;
Conference_Titel :
Test Conference, 2008. ITC 2008. IEEE International
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4244-2402-3
Electronic_ISBN :
1089-3539
DOI :
10.1109/TEST.2008.4700590
