Abstract :
The following topics are dealt with: model order reduction; signal and power integrity analysis; 3D IC interconnects; nano-interconnects; degradation and parasitic effects; macromodeling; and transmission lines and waveguides.
Keywords :
integrated circuit interconnections; nanoelectronics; three-dimensional integrated circuits; transmission lines; waveguides; 3D IC interconnects; degradation effects; macromodeling; model order reduction; nanointerconnects; parasitic effects; power integrity analysis; signal integrity analysis; transmission lines; waveguides;
Conference_Titel :
Signal Propagation on Interconnects (SPI), 2011 15th IEEE Workshop on
Conference_Location :
Naples
Print_ISBN :
978-1-4577-0466-6
Electronic_ISBN :
978-1-4577-0465-9
DOI :
10.1109/SPI.2011.5898826
