DocumentCode
1734741
Title
Preventing RFIC interference issues: A modeling methodology for floorplan development and verification of isolation- and grounding strategies
Author
Niehof, J. ; van Sinderen, J.
Author_Institution
NXP Semicond., Eindhoven, Netherlands
fYear
2011
Firstpage
11
Lastpage
14
Abstract
In order to prevent interference issues it is essential to make the right choices/trade-offs in the early phases of the IC design. A modeling methodology was developed to study the impact of physical design choices on the isolation behavior of the overall packaged and mounted RF product. This paper gives an overview of the various coupling paths and their relative contribution in the isolation/coupling. The simulation/modeling results are in good agreement with measurements.
Keywords
circuit layout; earthing; radiofrequency integrated circuits; RFIC interference issue; coupling paths; floorplan development; grounding strategy; isolation; physical design; Couplings; Grounding; Integrated circuit modeling; Noise; Radio frequency; Radiofrequency integrated circuits; Receivers;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects (SPI), 2011 15th IEEE Workshop on
Conference_Location
Naples
Print_ISBN
978-1-4577-0466-6
Electronic_ISBN
978-1-4577-0465-9
Type
conf
DOI
10.1109/SPI.2011.5898830
Filename
5898830
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