DocumentCode :
1734777
Title :
Parylene-strengthened thermal isolation technology for microfluidic system-on-chip applications
Author :
Shih, Chi-Yuan ; Chen, Yang ; Tai, Yu-Chong
Author_Institution :
Dept. of Electr. Eng., California Technol. Inst., Pasadena, CA, USA
Volume :
2
fYear :
2005
Firstpage :
1183
Abstract :
Here we reported a novel technology using parylene-cross-linking structure to achieve on-chip air-gap thermal isolation for microfluidic system-on-chip (SOC) applications. Two applications based on this technology, on-chip continuous-flow polymerase chain reaction (PCR) and on-chip temperature gradient liquid chromatography (LC) were successfully demonstrated. Device thermal performance in each example was characterized. Results showed that our technology not only provides excellent on-chip thermal isolation but also its simplicity of integration with other on-chip components makes versatile microfluidic SOC applications feasible.
Keywords :
air gaps; chromatography; isolation technology; microfluidics; polymers; surface treatment; system-on-chip; air gap; continuous flow polymerase chain reaction; device thermal performance; microfluidics; parylene; system-on-chip; temperature gradient liquid chromatography; thermal isolation technology; Conducting materials; Isolation technology; Microfluidics; Polymers; Resists; Silicon; System-on-a-chip; Temperature; Thermal conductivity; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
Print_ISBN :
0-7803-8994-8
Type :
conf
DOI :
10.1109/SENSOR.2005.1497289
Filename :
1497289
Link To Document :
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