Non-contact Testing for SoC and RCP (SIPs) at Advanced Nodes

Author

Moore, B. ; Mangrum, M. ; Sellathamby, C. ; Reja, M. ; Weng, T. ; Bai, B. ; Reid, E. ; Filanovsky, I. ; Slupsky, S.

Author_Institution

Scanimetrics Inc., Edmonton, AB

fYear

2008

Firstpage

1

Lastpage

10

Abstract

Non-contact methods for testing system-on-chip (SoC) and system in package (SIP) assemblies are presented. This method allows for high speed testing at the wafer level for SoCs as well as testing during and after assembly for panel or wafer level SIP technologies. Wafer testing at advanced nodes is carried out without damaging underlying metallurgy - an issue with current contact testing techniques. The technology utilizes non-contact GHz short-range transceivers to transfer test signals and results to and from SoC ICs. The wireless probes convert standard tester ATE logic levels to high frequency RF (GHz) transceiver signals and thus allow the use of standard test equipment. A reduced set of contact probes are used for test power only. A 45 nm fully CMOS compatible IC with wireless test transceivers is designed and fabricated. Enhancing the reliability and economics of IC manufacture by enabling non-contact testing of SoCs before and during packaging is a key benefit of this technology.

Keywords

integrated circuit testing; logic testing; system-in-package; system-on-chip; RCP; SoC; high speed testing; noncontact testing; system in package; system-on-chip; wafer testing; wireless test transceivers; Assembly systems; CMOS logic circuits; Integrated circuit testing; Logic testing; Packaging; Probes; System testing; System-on-a-chip; Transceivers; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 2008. ITC 2008. IEEE International

Conference_Location

Santa Clara, CA

ISSN

1089-3539

Print_ISBN

978-1-4244-2402-3

Electronic_ISBN

1089-3539

Type

conf

DOI

10.1109/TEST.2008.4700612

Filename

4700612