Title :
An analytical model of the RF impedance change due to solder joint cracking
Author :
Azarian, Michael H. ; Lando, Emile ; Pecht, Michael
Author_Institution :
Center for Adv. Life Cycle Eng. (CALCE), Univ. of Maryland, College Park, MD, USA
Abstract :
An analytical model is presented of the RF impedance change due to the cracking of a solder joint connecting a surface mount component to a transmission line (TL). This model provides insight into the underlying physical and electrical phenomena giving rise to the impedance changes which are experimentally observable. A distributed element model of a TL was developed which includes the geometrical parameters of a crack propagating through a solder fillet. The model was validated by comparison of the results to data obtained from laboratory measurements. In addition, a model of the DC resistance of the TL with a cracked solder joint was created. The two models were used to calculate and compare the sensitivity of the RF impedance and DC resistance to solder joint cracking as a function of crack geometry.
Keywords :
cracks; solders; surface mount technology; transmission lines; RF impedance change; solder fillet; solder joint cracking; surface mount component; transmission line; Impedance; Inductance; Mathematical model; Radio frequency; Resistance; Soldering; Transmission line measurements;
Conference_Titel :
Signal Propagation on Interconnects (SPI), 2011 15th IEEE Workshop on
Conference_Location :
Naples
Print_ISBN :
978-1-4577-0466-6
Electronic_ISBN :
978-1-4577-0465-9
DOI :
10.1109/SPI.2011.5898847
