Title :
Numerical simulation of impedance discontinuities resulting from degradation of interconnections on printed circuit boards
Author :
Manfredi, Paolo ; Azarian, Michael H. ; Canavero, Flavio G.
Author_Institution :
Dipt. di Elettron., Politec. di Torino, Torino, Italy
Abstract :
A 3-D model was developed for numerically simulating the effect of solder joint cracking on impedance. Some initial reflectometry results are reported of a microstrip transmission line as a crack propagates through a solder joint. Observations are made on the information obtained when using low-pass vs. band-pass modes for reconstructing reflectometry data from frequency domain results. A qualitative comparison is made with experimental results on samples with a design which is similar to the model. On the basis of these observations, approaches for improving the model and future applications are discussed.
Keywords :
cracks; frequency-domain analysis; interconnections; microstrip discontinuities; numerical analysis; printed circuits; reflectometry; solders; crack propagation; frequency domain; impedance discontinuity; microstrip transmission line; numerical simulation; printed circuit board interconnection; qualitative comparison; reflectometry data reconstruction; solder joint cracking; Band pass filters; Degradation; Impedance; Integrated circuit interconnections; Numerical models; Soldering; Time domain analysis;
Conference_Titel :
Signal Propagation on Interconnects (SPI), 2011 15th IEEE Workshop on
Conference_Location :
Naples
Print_ISBN :
978-1-4577-0466-6
Electronic_ISBN :
978-1-4577-0465-9
DOI :
10.1109/SPI.2011.5898848
