DocumentCode
1735234
Title
Comparison of chemical binding states between ultra shallow plasma doping (PD) and ion implantation (I/I) combined with Ge pre-amorphizaiton ion implantation (Ge-PAI) by using hard X-ray photoelectron spectroscopy (HX-PES)
Author
Jin, C.G. ; Kobata, M. ; Sasaki, Y. ; Okashita, K. ; Nakamoto, K. ; Mizuno, B. ; Ikenaga, E. ; Kobayashi, K.
Author_Institution
Ultimate Junction Technol. Inc., Moriguchi
fYear
2008
Firstpage
43
Lastpage
45
Abstract
We measured HX-PES (Si 1s) of ultra low energy ion implantation (I/I) samples combined with Ge pre-amorphizaiton ion implantation (Ge-PAI) before and after spike RTA, and compared it with that of plasma doping (PD) samples. As-doped I/I sample showed higher hole density compared to as-doped PD sample due to lower defect induced carrier trap. Ge-PAI+I/I sample showed strong asymmetric in lower binding energy region due to Si-Ge bonding. After spike RTA, PD sample showed superior impurity activation than that of Ge-PAI+I/I sample. Both Ge-PAI+I/I and PD sample showed excellent recrystallization after spike RTA.bonding.
Keywords
X-ray photoelectron spectra; amorphisation; binding energy; bonds (chemical); boron; doping profiles; electron traps; elemental semiconductors; germanium; hole density; hole traps; impurities; ion implantation; plasma materials processing; rapid thermal annealing; recrystallisation; semiconductor doping; silicon; HX-PES; Si:B,Ge; binding energy; carrier trap; chemical binding states; chemical bonding; hard X-ray photoelectron spectroscopy; hole density; impurity activation; preamorphizaiton ion implantation; rapid thermal annealing; recrystallization; spike RTA; ultra low energy ion implantion; ultrashallow plasma doping; Bonding; Chemicals; Doping; Energy measurement; Ion implantation; Plasma chemistry; Plasma density; Plasma immersion ion implantation; Plasma measurements; Plasma x-ray sources;
fLanguage
English
Publisher
ieee
Conference_Titel
Junction Technology, 2008. IWJT '08. Extended Abstracts - 2008 8th International workshop on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1737-7
Electronic_ISBN
978-1-4244-1738-4
Type
conf
DOI
10.1109/IWJT.2008.4540014
Filename
4540014
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