DocumentCode :
1735258
Title :
Silicon Based System-in-Package : a new technology platform supported by very high quality passives and system level design tools
Author :
Murray, F. ; LeCornec, F. ; Bardy, S. ; Bunel, C. ; Verhoeven, Jan F C ; van den Heuvel, F.C.M. ; Klootwijk, J.H. ; Roozeboom, F.
Author_Institution :
NXP Semicond., Caen
fYear :
2007
Firstpage :
149
Lastpage :
153
Abstract :
The very large development of home and domestic electronic appliances as well as portable device has led the microelectronics industry to evolve in two complimentary directions: "More Moore" with the continuous race towards extremely small dimensions hence the development of SoCs (system on chip) and more recently a new direction that we could name "More than Moore" with the integration of devices that were laying outside the chips and thus the creation of SiPs (system in package). The technology platform presented here is named silicon based system in package. This new platform is based upon the integration of passive devices into silicon. The four critical elements of this technology will be discussed in detail: passive integration, advanced packaging, new IC design development tools, and innovative testing
Keywords :
integrated circuit design; integrated circuit packaging; integrated circuit testing; passive networks; system-in-package; system-on-chip; advanced packaging; domestic electronic appliances; integrated circuit design; integrated circuit testing; passive circuits; system analysis; system-in-package; system-on-chip; CMOS technology; Electronics industry; Embedded software; Integrated circuit interconnections; Integrated circuit packaging; Moore´s Law; Semiconductor device packaging; Silicon; System-level design; System-on-a-chip; Energy management; Integrated circuit design; Interconnections; Packaging; Passive circuits; Reliability; System analysis and design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Silicon Monolithic Integrated Circuits in RF Systems, 2007 Topical Meeting on
Conference_Location :
Long Beach, CA
Print_ISBN :
0-7803-9764-9
Electronic_ISBN :
0-7803-9765-7
Type :
conf
DOI :
10.1109/SMIC.2007.322803
Filename :
4117348
Link To Document :
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