• DocumentCode
    1735381
  • Title

    Time-domain parametric sensitivity analysis of multiconductor transmission lines

  • Author

    Spina, D. ; Ferranti, F. ; Antonini, G. ; Dhaene, T. ; Knockaert, L.

  • Author_Institution
    Dept. of Inf. Technol., Ghent Univ. - IBBT, Ghent, Belgium
  • fYear
    2011
  • Firstpage
    125
  • Lastpage
    128
  • Abstract
    We present a new parametric macromodeling technique for lossy and dispersive multiconductor transmission lines (MTLs). This technique can handle design parameters, such as substrate or geometrical layout features, and provide time-domain sensitivity information for voltage and currents at the ports of the lines. It is based on a recently introduced spectral approach for the analysis of lossy and dispersive MTLs [1], [2] and it is suited to generate state-space models and synthesize equivalent circuits, which can be easily embedded into conventional SPICE-like solvers. Parametric macromodels which provide sensitivity information are well suited for design space exploration, design optimization and crosstalk analysis. A numerical example validates the proposed approach in both frequency and time domain.
  • Keywords
    SPICE; circuit optimisation; equivalent circuits; integrated circuit design; integrated circuit modelling; multiconductor transmission lines; time-domain analysis; SPICE-like solver; crosstalk analysis; current; design optimization; design parameter; design space exploration; dispersive multiconductor transmission line; equivalent circuit; geometrical layout feature; lossy multiconductor transmission line; parametric macromodeling; state-space model; substrate; time-domain parametric sensitivity analysis; voltage; Impedance; Numerical models; Time domain analysis; Wireless communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects (SPI), 2011 15th IEEE Workshop on
  • Conference_Location
    Naples
  • Print_ISBN
    978-1-4577-0466-6
  • Electronic_ISBN
    978-1-4577-0465-9
  • Type

    conf

  • DOI
    10.1109/SPI.2011.5898855
  • Filename
    5898855