• DocumentCode
    1735645
  • Title

    Defect Oriented Testing of the Strap Problem Under Process Variations in DRAMs

  • Author

    AL-Ars, Zaid ; Hamdioui, Said ; De Goor, Ad J van ; Mueller, Georg

  • Author_Institution
    Fac. of EE, Math. & CS, Delft Univ. of Technol., Delft
  • fYear
    2008
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    Efficient and effective methods are needed to generate defect oriented tests for todays VLSI circuits. This paper describes an industrial case study for using defect injection and Spice simulation to generate defect oriented tests for the so-called strap defects in DRAMs, taking both the sensitivity of this defect to process variations and bit line coupling into consideration. The paper discusses all the different stages of the test generation process, starting with defect modeling, followed by the simulation methodology, test generation and optimization, and finally test application and industrial evaluation performed in Qimonda. Results show that the generated tests have the same coverage as previously used tests with possible test time reduction of up to 59%. The analysis also identifies the slow process corner and the data backgrounds 11 and 01 as the most stressful combinations to test the strap. The paper also discusses a test method used to account for process variations and detect the fault in any process corner.
  • Keywords
    DRAM chips; SPICE; VLSI; integrated circuit testing; logic design; DRAM; Qimonda; Spice simulation; VLSI circuits; bit line coupling; defect injection; defect oriented testing; industrial case study; industrial evaluation; process variations; strap defects; strap problem; test generation process; test time reduction; Analytical models; Circuit faults; Circuit simulation; Circuit testing; Coupling circuits; Fault detection; Mathematics; Optimization methods; Performance evaluation; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2008. ITC 2008. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-2402-3
  • Electronic_ISBN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2008.4700631
  • Filename
    4700631