MEMS probe cards with tip-to-pad electric feed-through and automatically isolated metal coating

Author

Guo, Nanxiang ; Li, Xinxin ; Wang, Fei ; Wang, Yuclin ; Feng, Songlin

Author_Institution

Shanghai Inst. of Microsyst. & Inf. Technol., Chinese Acad. of Sci., Shanghai, China

Volume

2

fYear

2005

Firstpage

1330

Abstract

Presented is a newly developed MEMS probe-card with the technical requirements from Sino IC Technology Co. Ltd. for dies-under-test (DUT) of 8-inch wafers. By a double-sided metal overlapping scheme, electric feed-through is realized from the probe-tips at bottom to the automatic testing equipment (ATE) interface at topside. A recessed concave-step is formed to automatically isolate the adjacent probes when metal is sputtered on the cantilever-tips. A MEMS probe-card with nearly 100 silicon probes for simultaneously testing two dies is fabricated with bulk micromachining technology. Preliminary measurement shows below 1 Ω resistance for the feed-through electric connection from the tip to the wire-bonding pad.

Keywords

automatic test equipment; integrated circuit testing; micromachining; micromechanical devices; 1 ohm; MEMS; Sino IC Technology Co. Ltd; automatic testing equipment interface; automatically isolated metal coating; bulk micromachining; dies-under-test; probe card; tip-to-pad electric feed-through; wafer level IC testing; wire-bonding pad; Automatic testing; Coatings; Electric resistance; Electric variables measurement; Electrical resistance measurement; Isolation technology; Micromachining; Micromechanical devices; Probes; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on

Print_ISBN

0-7803-8994-8

Type

conf

DOI

10.1109/SENSOR.2005.1497326

Filename

1497326