Title :
Transient liquid phase (TLP) bonding for microsystem packaging applications
Author :
Welch, Warren, III ; Chae, Junseok ; Lee, Sang-Hyun ; Yazdi, Navid ; Najafi, Khalil
Author_Institution :
NSF ERC for Wireless Integrated MicroSyst., Michigan Univ., Ann Arbor, MI, USA
Abstract :
This paper explores the use of transient liquid phase bonding for microsystem packaging applications. Two types of bonds are demonstrated: a thin-film evaporated indium-gold bond and an electroplated nickel-tin bond. Both bonds are formed at 300°C for about 1.5 hours in a conventional wafer bonder. The wafers were heated to over 400 °C for more than an hour after bonding without any signs of bond degradation. The indium-gold bond demonstrated good electrical contact, but poor permeability performance. However, the nickel-tin bond was void free and sealed cavities with bond ring widths as little as 50 μm. The cross section of the nickel-tin TLP bond was analyzed with EDAX software to verify the formation of intermetallic compounds.
Keywords :
CAD/CAM; electrical contacts; electronics packaging; liquid phase deposition; micromechanical devices; soldering; wafer bonding; 300 C; EDAX software; MEMS packaging; bond degradation; diffusion soldering; electrical contact; electroplated nickel-tin bond; intermetallic compounds; microsystem packaging; thin-film evaporated indium-gold bond; transient liquid phase bonding; wafer bonding; Diffusion bonding; Indium; Integrated circuit packaging; Microelectromechanical devices; Silver; Soldering; Temperature; Tin; Wafer bonding; Wafer scale integration;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
Print_ISBN :
0-7803-8994-8
DOI :
10.1109/SENSOR.2005.1497331
