DocumentCode
1736070
Title
Field-grading with semi-conducting materials based on silicon carbide (SiC)
Author
Gartner, J. ; Gockenbach, E. ; Borsi, H.
Author_Institution
Schering-Inst. of High Voltage Tech. & Eng., Hannover Univ., Germany
Volume
1
fYear
1998
Firstpage
202
Abstract
This article discusses field-grading of components in high voltage equipment with semi-conducting materials based on silicon carbide (SiC). One application is the housing of high voltage fuses (hv-fuses), where different constraints must be taken into consideration. Housings for hv-fuses may consist of a dielectric basic material with inner and outer conducting layers, where the outer layer is grounded and the inner layer is on high voltage potential. The inner conducting layer is of special interest, because it must comply with different tasks: When the fuse is in normal operation, the field-grading must prevent partial discharge (PD) generation inside the fuse. If the fuse is open, the remaining current through the inner conducting layer must be negligible. Two different types of conducting layers are discussed: one kind consists of a ceramic overglaze, the other is based on different organic matrixes like silicon rubber, epoxy resin and silicon resin. SiC was used in different quantities, qualities and grain sizes, affecting the behavior of the conductive layer. The influences of these parameters are shown. The electrical behavior of both types of conductive layers, in dependence of various parameters like different voltage levels, temperature etc. are shown, as well as a comparison of both types. A numerical simulation of the behavior is proposed
Keywords
electric fuses; packaging; partial discharges; semiconductor materials; silicon compounds; HV fuse; SiC; ceramic overglaze; conducting layer; dielectric material; electrical properties; epoxy resin; field grading; grain size; high voltage component; housing; numerical simulation; organic matrix; partial discharge; semiconducting material; silicon carbide; silicon resin; silicon rubber; Active matrix organic light emitting diodes; Ceramics; Conducting materials; Dielectric materials; Epoxy resins; Fuses; Partial discharges; Rubber; Silicon carbide; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation, 1998. Conference Record of the 1998 IEEE International Symposium on
Conference_Location
Arlington, VA
ISSN
1089-084X
Print_ISBN
0-7803-4927-X
Type
conf
DOI
10.1109/ELINSL.1998.704697
Filename
704697
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