Title :
Wafer level reliability (WLR) special interest group (SIG)
fDate :
6/21/1905 12:00:00 AM
Keywords :
Condition monitoring; Extrapolation; Failure analysis; Life testing; Nonvolatile memory; Plasma measurements; Plasma temperature; Qualifications; Sampling methods; Time measurement;
Conference_Titel :
Integrated Reliability Workshop Final Report, 1999. IEEE International
Print_ISBN :
0-7803-5649-7
DOI :
10.1109/IRWS.1999.830586
