DocumentCode
1736130
Title
Burn-In
Author
Vollertsen, R.-P.
Author_Institution
Infineon Technol. Corp., IBM Corp., Essex Junction, VT
fYear
1999
fDate
6/21/1905 12:00:00 AM
Firstpage
167
Lastpage
173
Abstract
Burn-In is used to screen weak parts from a population of completely processed chips to assist in meeting reliability requirements. This tutorial provides a general introduction to burn-in. It is shown how burn-in improves the failure rate. Typical burn-in conditions, the burn-in models and an example of failure mechanisms are given. The impact of burn-in on technology reliability (hot carriers, gate oxide, electromigration) is discussed, emphasizing that the upper limits of the burn-in conditions can be controlled by technology reliability. Finally the benefits and disadvantages of burn-in are summarized
Keywords
electromigration; hot carriers; semiconductor device reliability; burn-in; completely processed chips; electromigration; failure mechanisms; gate oxide; hot carriers; reliability requirements; Aging; Costs; Degradation; Large Hadron Collider; Packaging; Petroleum; Rivers; Shape; Testing; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 1999. IEEE International
Conference_Location
Lake Tahoe, CA
Print_ISBN
0-7803-5649-7
Type
conf
DOI
10.1109/IRWS.1999.830588
Filename
830588
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