DocumentCode
1736185
Title
SiC epitaxial layers grown by chemical vapor deposition
Author
Wang, Yuehu ; Zhang, Yuming ; Zhang, Yimen ; Jia, Renxu ; Chen, Da
Author_Institution
Sch. of Microelectron., Xidian Univ., Xi´´an
fYear
2008
Firstpage
210
Lastpage
212
Abstract
Epitaxial growth of 4H-SiC is reported in a horizontal low-pressure hot-wall (LP-HW-CVD) reactor at temperature 1580degC and 100 mbar. The substrates were Si-face, n-type, 4H-SiC oriented 8deg off-axis toward the [1 12 macr 0] direction. Surface of SiC epitaxial layers were studied. Atomic force microscope (AFM) and scanning electron microscopy (SEM) were used to investigate the epitaxial layer surface. Fourier transform infrared spectroscopy (FTIR) was used to analysis epitaxial layers thickness. The surface roughness of the samples was analyzed using atomic force microscopy (AFM). Current-voltage (C-V) measurements determined the doping concentration in the films. The structural quality was assessed by X-ray diffraction rocking curves.
Keywords
Fourier transform spectra; X-ray diffraction; atomic force microscopy; chemical vapour deposition; doping profiles; infrared spectra; scanning electron microscopy; semiconductor doping; semiconductor epitaxial layers; semiconductor growth; silicon compounds; surface roughness; vapour phase epitaxial growth; wide band gap semiconductors; Fourier transform infrared spectroscopy; SiC; X-ray diffraction rocking curves; atomic force microscope; chemical vapor deposition; current-voltage data; doping concentration; epitaxial layer growth; horizontal low-pressure hot-wall reactor; scanning electron microscopy; structural quality; surface roughness; Atomic force microscopy; Atomic layer deposition; Atomic measurements; Chemical vapor deposition; Epitaxial growth; Epitaxial layers; Rough surfaces; Scanning electron microscopy; Silicon carbide; Surface roughness; AFM; CVD; FTIR; SEM; SiC;
fLanguage
English
Publisher
ieee
Conference_Titel
Junction Technology, 2008. IWJT '08. Extended Abstracts - 2008 8th International workshop on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1737-7
Electronic_ISBN
978-1-4244-1738-4
Type
conf
DOI
10.1109/IWJT.2008.4540053
Filename
4540053
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