DocumentCode
1737227
Title
Interconnect sizing and spacing with consideration of buffer insertion for simultaneous crosstalk-delay optimization
Author
Hasani, Fargol ; Masoumi, Nasser
Author_Institution
VLSI Res. Group, Univ. of Tehran, Tehran
fYear
2008
Firstpage
1
Lastpage
6
Abstract
As integrated circuits (ICs) are scaled into nanometre dimensions and operate in gigahertz frequencies, interconnects have become critical in determining system performance and reliability. In this paper we propose a new approach to investigate crosstalk reduction techniques which helps to have simultaneous optimization of interconnect delay and crosstalk noise in deep submicron VLSI circuits. The optimization problem is modelled by solving a new cost function to find a minimum cost for both crosstalk noise and delay which are conflicting in nature. Through MATLAB software, a system of three coupled wires is modelled as a RC distributed network. The results indicate the number of optimum available solutions including wire sizing, wire spacing and buffer insertion in which crosstalk reduction techniques can be useful for both crosstalk noise and delay.
Keywords
VLSI; circuit optimisation; crosstalk; electronic engineering computing; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; integrated circuit reliability; mathematics computing; nanoelectronics; MATLAB software; RC distributed network; buffer insertion; coupled wires; crosstalk noise; crosstalk reduction; deep submicron VLSI circuits; gigahertz frequencies; integrated circuits; interconnect sizing; interconnect spacing; nanometre dimensions; simultaneous crosstalk-delay optimization; system performance; system reliability; Cost function; Crosstalk; Delay; Frequency; Integrated circuit interconnections; Integrated circuit reliability; Mathematical model; System performance; Very large scale integration; Wire; Interconnect optimization; Nano scale; buffer insertion; coupling capacitance; crosstalk; delay; optimization algorithm; wire sizing; wire spacing;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology of Integrated Systems in Nanoscale Era, 2008. DTIS 2008. 3rd International Conference on
Conference_Location
Tozeur
Print_ISBN
978-1-4244-1576-2
Electronic_ISBN
978-1-4244-1577-9
Type
conf
DOI
10.1109/DTIS.2008.4540218
Filename
4540218
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