Title :
MCM-D technology for integrated passives components
Author :
Pieters, Philip ; De Raedt, Walter ; Beyne, Eric
Author_Institution :
MCP/MCM-group, IMEC, Leuven, Belgium
Abstract :
Integrated passive components are becoming of growing importance for new telecommunication circuits. In this paper, a thin film multilayer MCM-D technology for the integration of almost any type of passive structure is presented. The capabilities of the technology are demonstrated up to microwave frequencies through the examples of various realized integrated passive components.
Keywords :
capacitors; inductors; integrated circuit measurement; integrated circuit packaging; multichip modules; resistors; MCM-D technology; integrated passive components; microwave frequency capability; passive structure integration; telecommunication circuits; thin film multilayer MCM-D technology; Capacitors; Copper; Dielectric losses; Dielectric substrates; Dielectric thin films; Integrated circuit technology; Reflection; Resistors; Temperature; Testing;
Conference_Titel :
Microelectronics, 1999. ICM '99. The Eleventh International Conference on
Print_ISBN :
0-7803-6643-3
DOI :
10.1109/ICM.2000.884824
