DocumentCode
1737849
Title
MCM-D technology for integrated passives components
Author
Pieters, Philip ; De Raedt, Walter ; Beyne, Eric
Author_Institution
MCP/MCM-group, IMEC, Leuven, Belgium
fYear
1999
fDate
22-24 Nov. 1999
Firstpage
137
Lastpage
140
Abstract
Integrated passive components are becoming of growing importance for new telecommunication circuits. In this paper, a thin film multilayer MCM-D technology for the integration of almost any type of passive structure is presented. The capabilities of the technology are demonstrated up to microwave frequencies through the examples of various realized integrated passive components.
Keywords
capacitors; inductors; integrated circuit measurement; integrated circuit packaging; multichip modules; resistors; MCM-D technology; integrated passive components; microwave frequency capability; passive structure integration; telecommunication circuits; thin film multilayer MCM-D technology; Capacitors; Copper; Dielectric losses; Dielectric substrates; Dielectric thin films; Integrated circuit technology; Reflection; Resistors; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics, 1999. ICM '99. The Eleventh International Conference on
Print_ISBN
0-7803-6643-3
Type
conf
DOI
10.1109/ICM.2000.884824
Filename
884824
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