DocumentCode :
1737979
Title :
Space charge observation of a filler free epoxy resin
Author :
Fukunaga, K. ; Maeno, T. ; Griseri, V.
Author_Institution :
Commun. Res. Lab., Minist. of Posts & Telecommun., Tokyo, Japan
Volume :
1
fYear :
2000
fDate :
2000
Firstpage :
125
Abstract :
Space charge behaviour in epoxy resin and its effect on electrical ageing have been investigated for several years. For example, copper ion migration in an epoxy resin of a printed circuit board was observed by using the pulsed electroacoustic (PEA) space charge measurement system. In this work, a type of filler-free resins (CY1301) was used as a specimen in order to investigate the temperature dependence of space charge behaviour in an epoxy resin of which the glass transition temperature was just below 40°C. Space charge profiles were measured by the PEA method at 20°C and 40°C either under the electric field of 15 kV/mm or after the electrodes were short circuited. At 20°C, injected charges appeared near the electrodes. At 40°C, on the other hand, only surface charge on the electrode remained even though the electrodes were short-circuited. Although further investigation is required, it is clear that the space charge phenomena is strongly influenced by the temperature, and it could be related to the glass transition temperature of the resin
Keywords :
ageing; epoxy insulation; glass transition; space charge; 20 C; 40 C; CY1301; PEA method; electrical ageing; electrode surface charge; filler free epoxy resin; glass transition temperature; polymer insulation; pulsed electroacoustic space charge measurement; short-circuited electrodes; space charge observation; space charge profile measurement; temperature dependence; Aging; Charge measurement; Copper; Current measurement; Electrodes; Epoxy resins; Glass; Pulse measurements; Space charge; Temperature dependence;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2000 Annual Report Conference on
Conference_Location :
Victoria, BC
Print_ISBN :
0-7803-6413-9
Type :
conf
DOI :
10.1109/CEIDP.2000.885243
Filename :
885243
Link To Document :
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