DocumentCode
173854
Title
Exploration and optimization of heterogeneous interconnect fabric of 3D tree-based FPGA
Author
Pangracious, Vinod ; Marrakchi, Z. ; Beltaief, Nizar ; Mehrez, H. ; Farooq, Umar
Author_Institution
LIP6, Univ. Pierre & Marie Curie Paris VI, Paris, France
fYear
2014
fDate
6-8 May 2014
Firstpage
1
Lastpage
6
Abstract
We describe the design and exploration methodology to optimize 3-dimensional (3D) heterogeneous interconnect fabric of Tree-based FPGA (HT-FPGA) by introducing a break-point at a particular tree level interconnect to optimize the speed, power consumption and area. The ability of the flow to decide a horizontal or vertical partitioning of the multilevel programmable tree network based on design specifications is a defining feature. The break-point of vertically partitioned tree is designed to balance the placement of logic blocks and switch blocks into multiple tiers while the break-point of horizontally partitioned tree is designed to optimize the interconnect delay of the programmable tree network. We finally evaluate the performance, area and power consumption of the proposed 3D HT-FPGA using the newly developed flow and show that vertical and horizontally partitioned 3D stacked HT-FPGA improves speed by 16% and 55% respectively. Silicon footprint reduced by 50% for vertical and 46% for horizontal partitioning method and power consumption reduced by 35% compared to 2D counterpart.
Keywords
field programmable gate arrays; integrated circuit interconnections; logic design; trees (mathematics); 3-dimensional heterogeneous interconnect fabric optimization; 3D HT-FPGA; 3D tree-based FPGA; design methodology; design specification; exploration methodology; horizontally-partitioned tree; interconnect delay; logic blocks; multilevel programmable tree network; power consumption; silicon footprint; speed optimization; switch blocks; tree level interconnect; vertically-partitioned tree; Adders; Delays; Field programmable gate arrays; Integrated circuit interconnections; Optimization; Three-dimensional displays; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Design & Technology of Integrated Systems In Nanoscale Era (DTIS), 2014 9th IEEE International Conference On
Conference_Location
Santorini
Type
conf
DOI
10.1109/DTIS.2014.6850673
Filename
6850673
Link To Document