DocumentCode
1738745
Title
Resistance changes due to cu transport and precipitation during electromigration in submicrometric Al-0.5%Cu lines
Author
Scorzoni, A. ; de Murani, I. ; Balboni, R. ; Tamarri, F. ; Garulli, A. ; Fantin, F.
Author_Institution
Univ. di Parma
fYear
1996
fDate
1996
Firstpage
1691
Lastpage
1694
Keywords
Current density; Electric resistance; Electromigration; Performance analysis; Performance evaluation; Scanning electron microscopy; Temperature; Testing; Transmission electron microscopy; Utility programs;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN
0-7803-3369-1
Type
conf
DOI
10.1109/ESREF.1996.888193
Filename
888193
Link To Document