DocumentCode :
1738745
Title :
Resistance changes due to cu transport and precipitation during electromigration in submicrometric Al-0.5%Cu lines
Author :
Scorzoni, A. ; de Murani, I. ; Balboni, R. ; Tamarri, F. ; Garulli, A. ; Fantin, F.
Author_Institution :
Univ. di Parma
fYear :
1996
fDate :
1996
Firstpage :
1691
Lastpage :
1694
Keywords :
Current density; Electric resistance; Electromigration; Performance analysis; Performance evaluation; Scanning electron microscopy; Temperature; Testing; Transmission electron microscopy; Utility programs;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN :
0-7803-3369-1
Type :
conf
DOI :
10.1109/ESREF.1996.888193
Filename :
888193
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1738745
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