Title :
Study of the microstructure of IC interconnect metallisations using analytical transmission electron microscopy and secondary ion mass spectrometry
Author :
Cosemans, P. ; D´Olieslaeger, M. ; de Ceuninck, W. ; de Schepper, L. ; Stals, L.
Author_Institution :
Universitaire Campus
Keywords :
Artificial intelligence; Electromigration; Failure analysis; Grain size; Heating; Inorganic materials; Mass spectroscopy; Microstructure; Temperature; Transmission electron microscopy;
Conference_Titel :
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN :
0-7803-3369-1
DOI :
10.1109/ESREF.1996.888195
