DocumentCode

1738748

Title

Copper interconnection lines: SARF characterization and lifetime test

Author

Ciofi, C. ; Damlo, V. ; Neri, B.

Author_Institution

University of Pisa

fYear

1996

fDate

1996

Firstpage

1747

Lastpage

1750

Keywords

Artificial intelligence; Bonding; Copper; Electric resistance; Electromigration; Grain size; Lifetime estimation; Metallization; Substrates; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on

Print_ISBN

0-7803-3369-1

Type

conf

DOI

10.1109/ESREF.1996.888207

Filename

888207