Title :
Examination of reflow resistance for copper frame SMD products
Author :
Setoya, T. ; Matsuura, T. ; Furuta, K. ; Terui, Y. ; Seokawa, Y. ; Koike, S. ; Kishimura, Y.
Author_Institution :
Toshiba Micro-elctronics Corporation
Keywords :
Copper; Delamination; Inorganic materials; Iron; Moisture; Nickel; Packaging; Resins; Shearing; Stress;
Conference_Titel :
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN :
0-7803-3369-1
DOI :
10.1109/ESREF.1996.888218
