High density packaging of vertical-cavity surface-emitting laser arrays using micro-machined springs

We present a novel flip-chip packaging technology capable of interconnecting optoelectronic devices packed at very high density. The process utilizes micro-machined cantilevers for establishing electrical contact and is assembled at room temperature without solder. We have used the packaging technology to interconnect various optoelectronic devices, including 200-element arrays of independently addressable VCSELs having 4 μm-wide pads on 6 μm pitch to silicon CMOS driver chips with equally dense output lines