High density packaging of vertical-cavity surface-emitting laser arrays using micro-machined springs

Author

Chua, Christopher L. ; Fork, David K. ; Smith, Donald L. ; McIntyre, H. ; Ma, Dennis L. ; Zhu, Angela Q. ; Modi, Mitul ; Sitaraman, Srikrishna

Author_Institution

Xerox Palo Alto Res. Center, CA, USA

Volume

2

fYear

2000

fDate

2000

Firstpage

669

Abstract

We present a novel flip-chip packaging technology capable of interconnecting optoelectronic devices packed at very high density. The process utilizes micro-machined cantilevers for establishing electrical contact and is assembled at room temperature without solder. We have used the packaging technology to interconnect various optoelectronic devices, including 200-element arrays of independently addressable VCSELs having 4 μm-wide pads on 6 μm pitch to silicon CMOS driver chips with equally dense output lines

Keywords

flip-chip devices; micromachining; packaging; semiconductor laser arrays; surface emitting lasers; cantilever; electrical contact; flip-chip technology; high-density packaging; interconnection; micromachined spring; optoelectronic device; vertical cavity surface emitting laser array; Assembly; CMOS technology; Nanoscale devices; Optical arrays; Optical design; Optical interconnections; Packaging; Springs; Surface emitting lasers; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE

Conference_Location

Rio Grande

ISSN

1092-8081

Print_ISBN

0-7803-5947-X

Type

conf

DOI

10.1109/LEOS.2000.894019

Filename

894019