Title :
Superconducting sampling measurement system for characterization of electronic packaging
Author :
Aoyagi, Masahiro ; Sato, Hiroshi ; Nakagawa, Hiroshi ; Akoh, Hiroshi ; Toepfer, Hannes
Author_Institution :
Electrotech. Lab., Ibaraki, Japan
Abstract :
A superconducting sampling measurement system is a highly useful tool for analyzing ultrahigh speed electrical signals in cryogenic environments, due to a time resolution at ps levels with low current levels of μA. The digitizing sampling system is composed of a Josephson sampling circuit, digital delay line, feedback signal detection circuit and a computer. The Josephson sampling circuit is designed for ETL´s Nb-AlOx-Nb junction technology. A TDR measurement method using a CPW flip-chip bonding technique is proposed. The theoretical spatial resolution is estimated to reach around a hundred μm
Keywords :
aluminium compounds; circuit feedback; coplanar waveguides; delay lines; flip-chip devices; integrated circuit packaging; niobium; signal detection; signal processing equipment; signal sampling; superconducting integrated circuits; type II superconductors; CPW flip-chip bonding technique; Josephson sampling circuit; Josephson sampling circuit design; Nb-AlO-Nb; Nb-AlOx-Nb junction technology; TDR measurement method; cryogenic environments; current level; digital delay line; digitizing sampling system; electronic packaging characterization; feedback signal detection circuit; spatial resolution; superconducting sampling measurement system; time resolution; ultrahigh speed electrical signal analysis; Cryogenics; Current measurement; Delay lines; Electric variables measurement; Feedback circuits; Sampling methods; Signal analysis; Signal resolution; Time measurement; Velocity measurement;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895512
