DocumentCode
1740223
Title
Via and return path discontinuity impact on high speed digital signal quality
Author
Chen, Qinglun ; Zhao, Jin
fYear
2000
fDate
2000
Firstpage
215
Lastpage
218
Abstract
With the increase in digital signal bus speeds and fast rise time signals, small discontinuities like via and nonnormal return path on a bus are becoming more important factors for signal quality and timing. A long via has higher input impedance than normal trace transmission lines due to high inductance and low capacitance. Return path discontinuity (RPD) also produces impedance discontinuity due to local return inductance and capacitance changes. This paper discusses the effect of series via and parallel via coupling on signal quality and skew and analyzes the effect of signal trace referring power plane-RPD on signal quality and skew. A few recommendations reducing via and RPD discontinuities are given
Keywords
capacitance; digital circuits; electric impedance; inductance; integrated circuit interconnections; integrated circuit packaging; printed circuits; timing; RPD; capacitance; digital signal bus speed; fast rise time signal; high speed digital signal quality; impedance discontinuity; inductance; input impedance; local return capacitance change; local return inductance change; nonnormal return path; parallel via coupling; return path discontinuity; series via coupling; signal quality; signal skew; signal trace referring power plane-RPD; timing; trace transmission lines; via length; via path discontinuity; Capacitance; Connectors; Couplings; Impedance; Inductance; Packaging; Power transmission lines; Signal analysis; Timing; Transmission line discontinuities;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location
Scottsdale, AZ
Print_ISBN
0-7803-6450-3
Type
conf
DOI
10.1109/EPEP.2000.895531
Filename
895531
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