Enhanced transmission characteristics of on-chip interconnects with orthogonal gridded shield

Author

Lutz, R.D. ; Tripathi, V.K. ; Wiesshaar, A.

Author_Institution

Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA

fYear

2000

fDate

2000

Firstpage

329

Lastpage

332

Abstract

On-chip interconnects over an orthogonal grid of grounded lines on a silicon substrate are characterized by full-wave electromagnetic simulation. It is demonstrated that the shielding structure significantly enhances the transmission characteristics of on-chip interconnects. An equivalent circuit model for the shielded interconnects is also presented

Keywords

circuit simulation; electromagnetic interference; electromagnetic shielding; electromagnetic wave transmission; equivalent circuits; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; enhanced transmission characteristics; equivalent circuit model; full-wave electromagnetic simulation; grounded lines; on-chip interconnects; orthogonal grid; orthogonal gridded shield; shielded interconnects; shielding structure; silicon substrate; transmission characteristics; CMOS technology; Capacitance; Conductivity; Conductors; Equivalent circuits; Frequency; Inductance; Integrated circuit interconnections; Q factor; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Conference_Location

Scottsdale, AZ

Print_ISBN

0-7803-6450-3

Type

conf

DOI

10.1109/EPEP.2000.895556

Filename

895556