Analysis and improvement of Si integrated on-chip dipole antennas using high-k dielectric materials for ultra wideband signal transmission

In this paper, a linear on-chip dipole antenna pair on Si substrate is analyzed and simulated to investigate the transmission characteristics using CST MICROWAVE STUDIO. By inserting a 1.4 mm thick diamond layer between substrate and heat sink, the obtained transmission gain of antenna pair of length 4mm with 3mm separation on 10 Ohm-cm Si substrate increases by 12dB at 14GHz and for 1.5mm thick beryllia layer transmission gain increases 12 dB at 14.5 GHz. The effect of the dielectric materials like diamond, AlN, Alumina, beryllia, Taconic CER-10 and Arlon AR 1000thickness, substrate resistivity and the separation of an antenna pair on the transmission gain has been investigated. The results indicate that for highly dielectric materials of low electrical conductivity but high thermal conductivity, the transmission gain increases in real interconnection systems.