• DocumentCode
    1741296
  • Title

    A simulation and experimental study of 3D scalp spline Laplacian mapping

  • Author

    Lian, Jie ; Li, Guanglin ; Sasaki, Hiroshi ; He, Bin

  • Author_Institution
    Dept. of Bioeng., Illinois Univ., Chicago, IL, USA
  • Volume
    3
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    2350
  • Abstract
    A simulation and experimental study has been conducted on 3D scalp spline Laplacian mapping from EEG. Using the three-sphere inhomogeneous head model, the performance of the 3D scalp spline Laplacian algorithm was rigorously evaluated for a variety of brain source configurations under different noise levels. The present simulation results demonstrate the excellent performance of the 3D spline Laplacian algorithm in mapping and imaging the underlying cortical sources with much enhanced spatial resolution, as compared to the scalp potentials. Human experiments were further conducted to test the feasibility of scalp Laplacian mapping. Pattern reversal visual evoked potentials were recorded from 96 electrodes and the cortical sources at P100 were estimated. The VEP experiments demonstrate promising results that the present 3D spline Laplacian mapping can eliminate the misleading far field in the scalp potential map, and localize and map the underlying cortical sources induced by the visual stimuli
  • Keywords
    Laplace transforms; electroencephalography; medical signal processing; splines (mathematics); visual evoked potentials; 3D scalp spline Laplacian mapping; P100 sources; brain imaging; brain source configurations; different noise levels; enhanced spatial resolution; high-resolution EEG; inverse problem; pattern reversal visual evoked potentials; simulation; three-sphere inhomogeneous head model; underlying cortical sources; Brain modeling; Electroencephalography; Head; Humans; Laplace equations; Noise level; Scalp; Spatial resolution; Spline; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2000. Proceedings of the 22nd Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-6465-1
  • Type

    conf

  • DOI
    10.1109/IEMBS.2000.900616
  • Filename
    900616