DocumentCode
1741985
Title
Ablation of metals and semiconductors by ultrashort laser pulses
Author
von der Linde, D.
Author_Institution
Inst. fur Laser- und Plasmaphys., Essen Univ., Germany
fYear
2000
fDate
12-12 May 2000
Firstpage
189
Abstract
Summary form only given. Laser ablation plays an important role in the processing and structuring of materials. By suitably choosing laser parameters such as wavelength, intensity and pulse duration, ablation tan be tailored to meet specific tasks. Recently, it has been reported that ultrashort laser pulses provide distinct advantages in certain applications. These findings have stimulated interest in the physical understanding of the mechanisms of short pulse laser ablation.
Keywords
high-speed optical techniques; laser ablation; laser materials processing; metals; semiconductors; surface structure; laser materials processing; laser materials structuring; metals ablation; physical understanding; semiconductors; short pulse laser ablation; ultrashort laser pulses; Ambient intelligence; Conducting materials; Identity-based encryption; Lakes; Laser ablation; Laser theory; Optical materials; Optical pulses; Semiconductor lasers; Semiconductor materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Quantum Electronics and Laser Science Conference, 2000. (QELS 2000). Technical Digest
Conference_Location
San Francisco, CA, USA
ISSN
1094-5695
Print_ISBN
1-55752-608-7
Type
conf
Filename
901965
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