Title :
The study on the novel lead-free solder alloy
Author :
Le, Huang ; Qian, Wang ; Jusheng, Ma
Author_Institution :
Dept. of Mater. Sci. & Eng., Tsinghua Univ., Beijing, China
Abstract :
Sn-Pb solders are widely used in the electronics industry, but lead is to be restricted due to its toxicity. The properties of Sn-Ag-Cu and Sn-Ag-Zn system solder alloys are studied in this paper. The melting points of the solders are measured by DSC821e scan calorimeter and the hardness and solderability are also measured. The results show that the addition of small amounts of Cu or Zn into the Sn-Ag eutectic solders brings an increase in strength and solderability and the melting ranges only expand a little. Comparison of the results shows a perfect composition for the lead free solder
Keywords :
assembling; copper alloys; differential scanning calorimetry; environmental factors; hardness; health hazards; mechanical strength; melting point; packaging; silver alloys; tin alloys; zinc alloys; Sn-Ag eutectic solders; Sn-Ag-Cu system solder alloys; Sn-Ag-Zn system solder alloys; Sn-Pb solders; SnAgCu; SnAgZn; SnPb; electronics industry; hardness; lead free solder; lead toxicity; lead-free solder alloy; mechanical strength; melting point; scan calorimeter; solderability; Chemical elements; Copper; Electronics industry; Environmentally friendly manufacturing techniques; Lead compounds; Mechanical factors; Pollution measurement; Soldering; Temperature measurement; Zinc;
Conference_Titel :
Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on
Conference_Location :
Hong Kong
Print_ISBN :
0-7803-6654-9
DOI :
10.1109/EMAP.2000.904152
