Title :
Development of solder replacement isotropic conductive adhesives
Author :
Wong, C.P. ; Lu, D.
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
As a potential alternative to lead-bearing soldering technology, conductive adhesive technology has increasingly attracted the attention of the electronics industry. This new technology can offer numerous advantages over traditional soldering technology. However, some critical limitations of this technology have slowed its potentially wide application in the electronics industry. These limitations include lower electrical conductivity, increased contact resistance during elevated temperature and humidity aging, and poor impact performance. In the past few years, there have been tremendous efforts to address these issues, and conductive adhesive technology has advanced significantly. This paper gives an overview of the main research work and achievements in conductive adhesive technology
Keywords :
adhesives; ageing; assembling; conducting polymers; contact resistance; electrical conductivity; filled polymers; humidity; printed circuit manufacture; conductive adhesive technology; contact resistance; electrical conductivity; electronics industry; impact performance; lead-bearing soldering technology; solder replacement isotropic conductive adhesives; soldering technology; temperature/humidity aging; Batteries; Conducting materials; Conductive adhesives; Conductivity; Environmentally friendly manufacturing techniques; Independent component analysis; Lead; Polymers; Soldering; Tin;
Conference_Titel :
Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on
Conference_Location :
Hong Kong
Print_ISBN :
0-7803-6654-9
DOI :
10.1109/EMAP.2000.904171