Title :
Research of thick film copper circuit in microelectronic packaging
Author :
Xu, Z. ; Ma, J. ; Han, Z. ; Wang, Y. ; Huang, L. ; Tang, X.
Author_Institution :
Div. of Electron. Mater. & Packaging Technol., Tsinghua Univ., Beijing, China
Abstract :
Thick film copper circuits are a critical technology in microelectronic packaging. This paper emphasizes low temperature glass ceramics cofired with copper. Difficulties with LTCC/Cu packaging include organic removal and copper circuit protection. In different sintering techniques, by careful control of the oxygen partial pressure, the quality of the multilayer copper system can be ensured. Differential shrinkage characteristics of copper thick film and LTCC sheet result in delamination cracks and camber in the final products. Sintering promoters have an important effect on the conductivity and adhesion strength of copper thick film. The final structure of the sintered thick film appeared as a three-dimensional net
Keywords :
adhesion; ceramic packaging; copper; cracks; delamination; electrical conductivity; glass ceramics; hybrid integrated circuits; integrated circuit packaging; shrinkage; sintering; thick film circuits; 3D net final structure; Cu; LTCC sheet; LTCC/Cu packaging; O2; adhesion strength; camber; conductivity; copper; copper circuit protection; copper thick film; delamination cracks; differential shrinkage characteristics; low-temperature cofired glass ceramics; microelectronic packaging; multilayer copper system quality; organic removal; oxygen partial pressure; sintered thick film; sintering promoters; sintering techniques; thick film copper circuit; Ceramics; Copper; Glass; Microelectronics; Packaging; Pressure control; Protection; Temperature; Thick film circuits; Thick films;
Conference_Titel :
Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on
Conference_Location :
Hong Kong
Print_ISBN :
0-7803-6654-9
DOI :
10.1109/EMAP.2000.904193
