Title :
Microelectronic packaging and assembly roadmap for Hong Kong and Pearl River Delta region: a team study and recommendations
Author :
Tummala, R.R. ; Wong, C.P. ; Chan, Y.C.
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This study pertains to microelectronic packaging development in Hong Kong and the Pearl River Delta. It was undertaken at the request of the Department of Industry and Trade and was assigned to Prof Y.C. Chan of City University of Hong Kong. It lasted about one year and involved over 100 experts from industry, academia and government. The study makes a number of recommendations for the academic community, for the industry and for the government
Keywords :
assembling; integrated circuit manufacture; integrated circuit packaging; Hong Kong; Pearl River Delta region; microelectronic assembly; microelectronic packaging; microelectronic packaging development; microelectronic packaging/assembly roadmap; Assembly; Cellular phones; Electronics packaging; Government; Industrial electronics; Integrated circuit technology; Manufacturing; Microelectronics; Rivers; Software packages;
Conference_Titel :
Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd
Print_ISBN :
0-7803-6644-1
DOI :
10.1109/EPTC.2000.906344
