Title :
New hardware tools for the thermal transient testing of packages
Author :
Székely, Vladimir ; Rencz, Marta ; Poppe, Andreas ; Courtois, Bemard
Author_Institution :
Micred Ltd., Hungary
Abstract :
The paper presents a new thermal transient tester, which has unique features, both in the hardware design and in the evaluation software. Those features that have general significance and represent a scientific advance in the thermal transient measurement technique are presented in the paper. Thermal test dice are related devices to support the thermal characterisation of IC packages and packaging technologies. The aim of our work was to provide a set of actual test dice as well as IP designs of a scaleable size, starting from 2×2 mm2 through 6×6 mm2 up to a size of 24×24 mm2 , to cover the widest possible field of applications. The new features of this test die series are also presented in the paper, together with some application examples
Keywords :
integrated circuit design; integrated circuit packaging; integrated circuit testing; test equipment; thermal analysis; thermal management (packaging); transient analysis; 2 mm; 24 mm; 6 mm; IC packages; IC packaging technologies; evaluation software; hardware design; hardware tools; packages; scaleable size IP designs; test die series features; thermal characterisation; thermal test dice; thermal transient measurement technique; thermal transient tester; thermal transient testing; Electronic packaging thermal management; Hardware; Impedance; Integrated circuit packaging; Integrated circuit testing; Laboratories; Measurement techniques; Software measurement; Temperature dependence; Thermal factors;
Conference_Titel :
Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd
Print_ISBN :
0-7803-6644-1
DOI :
10.1109/EPTC.2000.906348
