DocumentCode :
1743089
Title :
Development of thermodynamic database for micro-soldering alloys
Author :
Ohnuma ; Liu, X.J. ; Ohtani, H. ; Anzai, K. ; Kainuma, R. ; Ishida, K.
Author_Institution :
Dept. of Mater. Sci., Tohoku Univ., Sendai, Japan
fYear :
2000
fDate :
2000
Firstpage :
91
Lastpage :
96
Abstract :
Recent progress on the database of calculated phase diagrams in micro-soldering alloy systems, which consist of Pb, Bi, Sn, Sb, Cu, Ag, In and Zn, is presented. Experimental determination of phase equilibria was conducted in several binary, ternary and quaternary systems by DSC, EDX and X-ray diffraction techniques. Based on these experiments, as well as on previous data on phase diagrams and thermo-chemical properties such as activity, heat of mixing and enthalpy of formation, the various thermodynamic parameters for describing the Gibbs energies of the different constituent phases were optimized and evaluated by the CALPHAD (calculation of phase diagrams) method. The database provides key information on liquidus and solidus surfaces, isothermal and vertical section diagrams, and mole fractions of the phase constitutions of multi-component soldering alloys. Thermodynamic properties of the surface tension and viscosity of the liquid phase can also be predicted. Moreover, a nonequilibrium solidification process using the Scheil model was simulated. Several phase diagrams of Pb-bearing and Pb-free solders are presented. The database is expected to be a powerful tool and an indispensable resource for the development of new Pb-free solders
Keywords :
X-ray chemical analysis; X-ray diffraction; assembling; database management systems; differential scanning calorimetry; electronic design automation; enthalpy; environmental factors; free energy; heat of mixing; packaging; phase diagrams; soldering; solidification; surface tension; thermodynamic properties; viscosity; Ag; Bi; CALPHAD method; Cu; DSC; EDX; Gibbs energies; In; Pb; Pb-bearing solders; Pb-free solders; PbSn; PbSnBi; PbSnSb; Sb; Scheil model; Sn; SnAg; SnAgBi; SnAgCu; SnAgCuBi; SnAgIn; SnAgZn; X-ray diffraction techniques; Zn; activity; binary systems; calculation of phase diagrams method; constituent phases; enthalpy of formation; heat of mixing; isothermal diagrams; liquid phase; liquidus surfaces; micro-soldering alloy systems; micro-soldering alloys; mole fractions; multi-component soldering alloys; nonequilibrium solidification process; phase constitutions; phase diagrams; phase equilibria; quaternary systems; solidus surfaces; surface tension; ternary systems; thermo-chemical properties; thermodynamic database; thermodynamic parameters; thermodynamic properties; vertical section diagrams; viscosity; Bismuth; Copper alloys; Databases; Isothermal processes; Optimization methods; Solid modeling; Thermodynamics; Tin alloys; X-ray diffraction; Zinc;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd
Print_ISBN :
0-7803-6644-1
Type :
conf
DOI :
10.1109/EPTC.2000.906355
Filename :
906355
Link To Document :
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