Title :
Methodology for a highly accelerated solder joint reliability test
Author :
Pang, H.L.J. ; Ang, K.H. ; Shi, X.Q. ; Wang, Z.P.
Author_Institution :
Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore
Abstract :
A thermo-mechanical deflection system (TMDS) test method has been developed for evaluating the fatigue performance of solder joints in printed circuit board (PCB) assemblies. The TMDS test imparts cyclic twisting deflections on an assembled PCB test vehicle which is tested under controlled isothermal conditions in a thermal chamber. Tests were conducted at various angles of twist and isothermal conditions at 100°C and 25°C. Failure analysis using SEM showed that the solder joint failure for the TMDS test is comparable to the failure mechanisms for accelerated thermal cycling (ATC) test failures for solder joints. Weibull failure distribution plots for TMDS and ATC tests were compared and a scale factor (SF) was used to correlate the test results
Keywords :
Weibull distribution; assembling; circuit reliability; failure analysis; fatigue; life testing; printed circuit testing; soldering; 100 C; 25 C; PCB assemblies; SEM; TMDS test; TMDS test method; Weibull failure distribution plots; accelerated thermal cycling test failures; assembled PCB test vehicle; controlled isothermal conditions; cyclic twisting deflections; failure analysis; failure mechanisms; fatigue performance; highly accelerated solder joint reliability test; isothermal conditions; printed circuit board; scale factor; solder joint failure; solder joints; test result correlation; thermal chamber; thermo-mechanical deflection system; twist angles; Assembly systems; Circuit testing; Failure analysis; Fatigue; Isothermal processes; Life estimation; Printed circuits; Soldering; System testing; Thermomechanical processes;
Conference_Titel :
Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd
Print_ISBN :
0-7803-6644-1
DOI :
10.1109/EPTC.2000.906405
