The advent of 3-D package age

Author

Wu, Larry ; Wang, Yu-Po ; Kee, S.C. ; Wallace, Bob ; Hsiao, C.S. ; Yeh, C.K. ; Her, T.D. ; Lo, Randy

Author_Institution

Siliconware Precision Ind. Co. Ltd., Taichung, Taiwan

fYear

2000

fDate

2000

Firstpage

102

Lastpage

107

Abstract

The three-dimensional (3D) package is one type of multi-die package (MDP). Unlike most MDPs, the dice inside 3D packages are stacked vertically. Although it is not a new concept, 3D packaging has not been widely implemented in mass production until recent years (Sidharth et al. 2000; Gannamani et al. 1999; Kada, 1999). Advanced portable products that require high spatial density as well as performance are driving this technology into a new age. However, without a solid and manufacturable assembly technology, 3D packages will still be too costly to be implemented. In this paper, the challenges in 3D packaging assembly such as backgrinding, die-attach, wire bonding and overmolding are investigated. Also, the cost-performance trade-offs of various 3D packages are discussed

Keywords

encapsulation; grinding; integrated circuit bonding; integrated circuit interconnections; integrated circuit packaging; lead bonding; moulding; multichip modules; 3D package; 3D package cost; 3D packaging; 3D packaging assembly; MDPs; backgrinding; cost-performance trade-offs; die-attach; manufacturable assembly technology; mass production; multi-die package; overmolding; portable products; spatial density; vertically stacked dice; wire bonding; Assembly; Bonding; Digital audio players; Electronics packaging; Flash memory; Foot; Manufacturing; Random access memory; Space technology; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 2000. Twenty-Sixth IEEE/CPMT International

Conference_Location

Santa Clara, CA

ISSN

1089-8190

Print_ISBN

0-7803-6482-1

Type

conf

DOI

10.1109/IEMT.2000.910714

Filename

910714