Line-structured laser scanning measurement system for BGA lead coplanarity

Author

Sun, Changku ; Shi, Hongyan ; Qiu, Yu ; Ye, Shenghua

Author_Institution

State Key Lab. of Precision Meas. Technol. & Instrum., Tianjin Univ., China

fYear

2000

fDate

2000

Firstpage

715

Lastpage

718

Abstract

This paper presents line-structured laser scanning measurement technology in SMT-based BGA chip leads´ coplanarity. An experimental measurement system is put forward. A corresponding mathematical model and contact-datum-plane assessment method on BGA chip lead coplanarity is established. A study of optical image splitting and splicing technology is made illustrating the capability of higher resolution. The experimental studies on a 20×20 BGA chip is carried out; the inaccuracy error of the measurement system is 2σ=0.033 mm

Keywords

ball grid arrays; inspection; integrated circuit packaging; measurement by laser beam; optical scanners; surface mount technology; BGA lead coplanarity; SMT; contact-datum-plane assessment method; line-structured laser scanning measurement system; mathematical model; optical image splitting; resolution; splicing technology; Charge coupled devices; Laser beams; Lead; Lenses; Mathematical model; Mathematics; Optical sensors; Semiconductor device measurement; Size measurement; Splicing;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 2000. IEEE APCCAS 2000. The 2000 IEEE Asia-Pacific Conference on

Conference_Location

Tianjin

Print_ISBN

0-7803-6253-5

Type

conf

DOI

10.1109/APCCAS.2000.913620

Filename

913620