Title :
3-D electromagnetic analysis of the package influence on the IC performance
Author :
Nosal, Zbigniew ; Abramowicz, Adam
Author_Institution :
Inst. of Electron. Syst., Warsaw Univ. of Technol., Poland
Abstract :
An integrated circuit package has been analyzed using the 3-dimensional FDTD simulator. The finite isolation between IC leads and the lead impedances can be precisely computed. The computed characteristics have been used to develop a circuit model of the package. Then the influence of the package on the integrated circuit performance has been investigated with high-frequency circuit simulators. Presented results show the necessity of including package properties in the RF and microwave IC design process
Keywords :
circuit simulation; electric impedance; finite difference time-domain analysis; integrated circuit packaging; microwave integrated circuits; 3-dimensional FDTD simulator; 3D electromagnetic analysis; IC design; IC performance; RF IC; circuit model; finite isolation; high-frequency circuit simulators; integrated circuit package; lead impedances; microwave IC; Analytical models; Circuit simulation; Computational modeling; Electromagnetic analysis; Finite difference methods; Impedance; Integrated circuit packaging; Microwave integrated circuits; Radio frequency; Time domain analysis;
Conference_Titel :
Microwaves, Radar and Wireless Communications. 2000. MIKON-2000. 13th International Conference on
Conference_Location :
Wroclaw
Print_ISBN :
83-906662-3-5
DOI :
10.1109/MIKON.2000.913995
