Title :
Self-doping contacts to silicon using silver coated with a dopant source [for solar cells]
Author :
Meier, D.L. ; Davis, H.P. ; Garcia, R.A. ; Jessup, J.A. ; Carroll, A.F.
Author_Institution :
EBARA Solar Inc., Jefferson Hills, PA, USA
Abstract :
A contact system for silicon solar cells is described in which silver is coated with a layer of dopant and alloyed with silicon, thereby simultaneously doping the silicon substrate and forming a low-resistance ohmic contact to it. The concept has been demonstrated using evaporated silver with commercially available phosphorus and boron liquid dopants. Silicon surface topography, along with I-V and SIMS analyses all indicate that the Ag-Si eutectic temperature (835°C) must be exceeded and the dopant coating must be present for the contact to be self-doping. The concept has also been implemented in the form of screen-printable silver pastes with phosphorus. A fritless version of the paste exhibited only 3 mΩ-cm2 contact resistance directly to 7 Ω-cm n-type dendritic web silicon. For contacting lightly-doped n+ layers (<100 Ω/□) through SiNx, a fritted version is used. The resultant contact metal is highly conductive (3 μΩ-cm) and solderable. No carrier lifetime degradation associated with the alloying process has been observed in dendritic web silicon solar cells
Keywords :
elemental semiconductors; ohmic contacts; secondary ion mass spectroscopy; semiconductor device measurement; semiconductor device testing; semiconductor doping; silicon; silver; solar cells; 3 muohmcm; 7 ohmcm; 835 C; Ag; I-V analyses; SIMS analyses; Si; Si solar cells; alloying process; carrier lifetime; dendritic web silicon solar cells; dopant source; low-resistance ohmic contact formation; screen-printable silver pastes; self-doping contacts; silicon substrate doping; silver coating; surface topography; Boron; Coatings; Contact resistance; Doping; Ohmic contacts; Photovoltaic cells; Silicon alloys; Silver; Surface topography; Temperature;
Conference_Titel :
Photovoltaic Specialists Conference, 2000. Conference Record of the Twenty-Eighth IEEE
Conference_Location :
Anchorage, AK
Print_ISBN :
0-7803-5772-8
DOI :
10.1109/PVSC.2000.915755