Title :
Research in the field of systems-in-a-package at the Interuniversity Microelectronics Center (IMEC)
Author_Institution :
IMEC, Leuven, Belgium
Abstract :
Systems-in-a-package technologies are likely to be extremely important in numerous fields. After discussion of a number of visions and trends, the work at the Interuniversity Microelectronics Center (IMEC) on systems-in-a-packcage for RF, optical, infrared and biosensor applications is discussed
Keywords :
biosensors; image sensors; infrared detectors; integrated circuit interconnections; integrated circuit packaging; integrated optoelectronics; microwave integrated circuits; multichip modules; optical interconnections; IMEC; Interuniversity Microelectronics Center; MCM; RF applications; biosensor applications; infrared applications; optical applications; systems-in-a-package; systems-in-a-package technologies; Biomedical optical imaging; Biosensors; Microelectromechanical devices; Microelectronics; Nonhomogeneous media; Optical interconnections; Optical sensors; Packaging; Radio frequency; Substrates;
Conference_Titel :
Microelectronics, 2000. ICM 2000. Proceedings of the 12th International Conference on
Conference_Location :
Tehran
Print_ISBN :
964-360-057-2
DOI :
10.1109/ICM.2000.916405
